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Founded in 2011 Sarcina Technology is a semiconductor packaging company in Palo Alto California USA with a design office in Hsinchu Taiwan It is led by industrial veterans from places like AT T Bell Labs DEC Intel and TSMC Sarcina Technology provides
21-22 November 2022
CadenceLIVE Europe 2022 will be held on November 21-22 at the Hilton Munich Park hotel. It will feature peer presentations that offer solutions for today’s design challenges that will impact tomorrow’s products. CadenceLIVE brings together users, dev
Event Ended
Hybrid
Free
Munich